Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法对特件后部封装中的压焊工艺进行参数优化设计。

The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.

本文对一些毫特势混频二极管本征噪声温度进行测试和分析。介绍在常温和致冷下混频二极管本征噪声的测试方法。