Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧树脂为基体,间和氨基甲烷低融点混合物为固,粉为导电填料,制备了热固各向同性导电胶。