phenylenediamine

Novel controlled releasing polythiourea microcapsules were prepared from terephthaloyl diisothiocyanate and o-phenylenediamine by interfacial polycondensation.

以对甲酰异硫氰酸酯和邻为原料通过界面缩聚法合成了聚硫脲缓释微胶囊。

Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧树脂为基体,间和氨基甲烷的低融点混合物为固化剂,铜粉为导电填料,制备了热固化各向同性导电胶。