Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂
基
,
二胺和二氨基二甲烷的低融点混合物固化剂,铜粉导电填料,制备了热固化各向同
导电胶。
甲烷Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂基,二胺和二氨基二甲烷的低融点混合物固化剂,铜粉导电填料,制备了热固化各向同导电胶。
声明：以上例句、词
类均由互联网资源自动生成，部未经过人工审核，其表达内容亦不代表本软件的观点；若发现问题，欢迎向我们指正。
