Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂体,间
胺和
氨
甲烷的低融点混合物
固化剂,铜粉
导
填料,制备了热固化各向同性导
。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂体,间
胺和
氨
甲烷的低融点混合物
固化剂,铜粉
导
填料,制备了热固化各向同性导
。
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